Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Apr 04, 2018
- Source ID
- 10.1103/physrevapplied.9.044005
Entities
People
- Daniel Valencia
- Evan Wilson
- Gerhard Klimeck
- Gustavo A. Valencia-zapata
- Kuang-chung Wang
- Michael Povolotskyi
- Zhengping Jiang
Organizations
- Defense Advanced Research Projects Agency
- National Nuclear Security Administration
- National Science Foundation
- United States Department of Energy