Chiplets in Wafers (CiW) - Process Design Kit and Demonstration of High-Frequency Circuits with GaN Chiplets in Silicon Interposers

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 01, 2021
Source ID
10.1109/ectc32696.2021.00039

Entities

People

  • Florian Herrault
  • Haw Tai
  • Ignacio Ramos
  • Joel Wong
  • Matthew King

Organizations

  • Defense Advanced Research Projects Agency