I/O Architecture, Substrate Design, and Bonding Process for a Heterogeneous Dielet-Assembly based Waferscale Processor

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 01, 2021
Source ID
10.1109/ectc32696.2021.00057

Entities

People

  • Haris Suhail
  • Irina Alam
  • Krutikesh Sahoo
  • Puneet Gupta
  • Rakesh Kumar
  • Saptadeep Pal
  • Subramanian Iyer
  • Sudhakar Pamarti

Organizations

  • Defense Advanced Research Projects Agency
  • University of California, Los Angeles