Copper to gold thermal compression bonding in heterogenous wafer-scale systems

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 01, 2021
Source ID
10.1109/ectc32696.2021.00088

Entities

People

  • Krutikesh Sahoo
  • Niloofar Shakoorzadeh
  • Saptadeep Pal
  • Subramanian Iyer
  • Yu-tao Yang

Organizations

  • Defense Advanced Research Projects Agency
  • Semiconductor Research Corporation