Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jun 01, 2021
- Source ID
- 10.1109/ectc32696.2021.00194
Entities
People
- Hae-In Kim
- Renuka Bowrothu
- Woosol Lee
- Yong-kyu Yoon
Organizations
- United States Department of Defense