Design and Development of High Density Fan-Out Wafer Level Package (HD-FOWLP) for Deep Neural Network (DNN) Chiplet Accelerators using Advanced Interface Bus (AIB)
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jun 01, 2021
- Source ID
- 10.1109/ectc32696.2021.00204
Entities
People
- Dutta Rahul
- Mihai D. Rotaru
- Wei Tang
- Zhengya Zhang
Organizations
- Defense Advanced Research Projects Agency
- Office of Naval Research