Characterization of Chip-to-Package Interconnects for Glass Panel Embedding (GPE) for Sub-THz Wireless Communications

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 01, 2021
Source ID
10.1109/ectc32696.2021.00364

Entities

People

  • Madhavan Swaminathan
  • Serhat Erdogan
  • Siddharth Ravichandran
  • Xiaofan Jia

Organizations

  • Defense Advanced Research Projects Agency