Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- May 01, 2022
- Source ID
- 10.1109/ectc51906.2022.00149
Entities
People
- Kexin Hu
- Manos M. Tentzeris
- Suresh K. Sitaraman
- Yi Zhou
Organizations
- Georgia Tech
- United States Army Research Laboratory