Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration

Document Details

Document Type
Pub Defense Publication
Publication Date
Oct 01, 2020
Source ID
10.1109/iccd50377.2020.00030

Entities

People

  • Hakki Mert Torun
  • Jinwoo Kim
  • Madhavan Swaminathan
  • Majid Ahadi Dolatsara
  • Nael Mizanur Rahman
  • Saibal Mukhopadhyay
  • Sung Kyu Lim
  • Venkata Chaitanya Krishna Chekuri