Design for 3D Stacked Circuits
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Dec 11, 2021
- Source ID
- 10.1109/iedm19574.2021.9720553
Entities
People
- E. Rotenberg
- Hsi-An Pan
- James D. Stevens
- Joshua Schabel
- L. Baker
- P. Franzon
- S. Lipa
- Saikat Dey
- T. Nigussie
- W. Davis
- Wen Li
Organizations
- Defense Advanced Research Projects Agency
- Intel Corporation
- National Science Foundation
- North Carolina State University
- Qualcomm