Low Temperature Solder Interconnection of Surface Mount Devices with Additively Printed Pads on Flexible Substrate

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 01, 2021
Source ID
10.1109/itherm51669.2021.9503253

Entities

People

  • Kartik Goyal
  • Kyle Schulze
  • Pradeep Lall
  • Scott R. Miller

Organizations

  • Air Force Research Laboratory
  • Manufacturing Institute