Across Substrate Lateral Dimensional Repeatability Using a Highly-Anisotropic Deep Etch Process on Fused Silica Material Layers
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Feb 01, 2018
- Source ID
- 10.1109/jmems.2017.2786282
Entities
People
- Michael Huff
- Michael Pedersen
Organizations
- Defense Advanced Research Projects Agency