Double-Sided Process for MEMS SOI Sensors With Deep Vertical Thru-Wafer Interconnects

Document Details

Document Type
Pub Defense Publication
Publication Date
Apr 01, 2018
Source ID
10.1109/jmems.2017.2786663

Entities

People

  • Alexandra Efimovskaya
  • Andrei M. Shkel
  • Yu-Wei Lin

Organizations

  • Defense Advanced Research Projects Agency