Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter Process
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Aug 01, 2018
- Source ID
- 10.1109/jmems.2018.2843722
Entities
People
- A Sandoughsaz
- Kevin J. Owen
- Khalil Najafi
- Yemin Tang
Organizations
- United States Army Research Laboratory