Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers

Document Details

Document Type
Pub Defense Publication
Publication Date
Mar 01, 2016
Source ID
10.1109/lmwc.2016.2524506

Entities

People

  • Gary S. May
  • Hanju Oh
  • Muhannad S. Bakir
  • Paragkumar A. Thadesar

Organizations

  • Defense Advanced Research Projects Agency