An Ultrawide Ku- To W-Band Array Antenna Package Using Flip-Chipped Silicon Integrated Passive Device With Multilayer PCB Technology
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jul 01, 2021
- Source ID
- 10.1109/lmwc.2021.3074940
Entities
People
- Ching-Wen Chiang
- ChungâTse Michael Wu
- Nai-Chen Liu
- Neda Khiabani
- Yen-Cheng Kuan
Organizations
- Defense Advanced Research Projects Agency
- National Science and Technology Council