Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks

Document Details

Document Type
Pub Defense Publication
Publication Date
Apr 01, 2016
Source ID
10.1109/mdat.2015.2480710

Entities

People

  • Ankur Srivastava
  • Caleb Serafy
  • Yogendra Joshi
  • Yuanchen Hu
  • Zhiyuan Yang

Organizations

  • Defense Advanced Research Projects Agency
  • Division of Computing and Communication Foundations