Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires

Document Details

Document Type: Pub Defense Publication
Publication Date: Dec 01, 2018
Source ID: 10.1109/tcad.2018.2801221

Entities

People

Chase Cook
Ertugrul Demircan
Mehul D. Shroff
Sheldon X.-D. Tan
Zeyu Sun

Organizations

Defense Advanced Research Projects Agency
National Science Foundation