Evaluation of Thermal Cycling Reliability of Sintered Nanosilver Versus Soldered Joints by Curvature Measurement

Document Details

Document Type: Pub Defense Publication
Publication Date: May 01, 2014
Source ID: 10.1109/tcpmt.2013.2296315

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People

Guo-quan Lu
Khai D. T. Ngo
Li Jiang
Shufang Luo
Thomas Guangyin Lei