Investigation of Quilt Packaging Interchip Interconnect With Solder Paste

Document Details

Document Type
Pub Defense Publication
Publication Date
Mar 01, 2014
Source ID
10.1109/tcpmt.2014.2301738

Entities

People

  • Alfred M. Kriman
  • David Kopp
  • Gary H. Bernstein
  • Mohammad Ashraf Khan
  • Patrick Fay
  • Quanling Zheng

Organizations

  • United States Department of Defense