Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 01, 2014
Source ID
10.1109/tcpmt.2014.2364742

Entities

People

  • Muhannad S. Bakir
  • Yang Zhang
  • Yue Zhang

Organizations

  • Defense Advanced Research Projects Agency