Thermal Isolation Using Air Gap and Mechanically Flexible Interconnects for Heterogeneous 3-D ICs

Document Details

Document Type
Pub Defense Publication
Publication Date
Jan 01, 2016
Source ID
10.1109/tcpmt.2015.2505670

Entities

People

  • Chaoqi Zhang
  • Muhannad Bakir
  • Muneeb Zia
  • Thomas E. Sarvey
  • Yang Zhang
  • Yue Zhang

Organizations

  • Defense Advanced Research Projects Agency