3-D TSV Six-Die Stacking and Reliability Assessment of 20- $\mu$ m-Pitch Bumps on Large-Scale Dies
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 01, 2017
- Source ID
- 10.1109/tcpmt.2016.2628372
Entities
People
- Jie Li Aw
- Jong Bum Lee
- Min Woo Rhee
Organizations
- Intelligence Advanced Research Projects Activity
- Office of the Director of National Intelligence
- Sandia National Laboratories