Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

Document Details

Document Type
Pub Defense Publication
Publication Date
Oct 01, 2017
Source ID
10.1109/tcpmt.2017.2737550

Entities

People

  • Andrew A. Wright
  • Charles Harrity
  • Dennis W. Prather
  • Kevin Shreve
  • Peng Yao
  • Richard D. Martin
  • Shouyuan Shi
  • Yifei Zhang