Flexible Hybrid Electronics Technology Using Die-First FOWLP for High-Performance and Scalable Heterogeneous System Integration

Document Details

Document Type
Pub Defense Publication
Publication Date
Oct 01, 2018
Source ID
10.1109/tcpmt.2018.2871603

Entities

People

  • Adeel Bajwa
  • Amir Hanna
  • Arsalan Alam
  • Siva Chandra Jangam
  • Subramanian Iyer
  • Takafumi Fukushima

Organizations

  • Air Force Research Laboratory
  • Defense Advanced Research Projects Agency

Tags

Technology Areas

  • Microelectronics