Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 01, 2019
Source ID
10.1109/tcpmt.2019.2930481

Entities

People

  • Ankit Kaul
  • Aravind Dasu
  • Muhannad S. Bakir
  • Ravi Gutala
  • Sreejith Kochupurackal Rajan
  • Thomas E. Sarvey

Organizations

  • Defense Advanced Research Projects Agency
  • Georgia Tech
  • National Science Foundation