Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 01, 2020
Source ID
10.1109/tcpmt.2020.3033257

Entities

People

  • Andrew C Kummel
  • Charles H Winter
  • Jonathan Hollin
  • Michael Breeden
  • Ming-Jui Li
  • Muhannad S. Bakir
  • Nyi Myat Khine Linn
  • Victor Wang

Organizations

  • Defense Advanced Research Projects Agency
  • National Science Foundation
  • Semiconductor Research Corporation