Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 01, 2021
Source ID
10.1109/tcpmt.2021.3091555

Entities

People

  • Bikramjit Chatterjee
  • Brian M. Foley
  • Christopher Nordquist
  • Daniel Shoemaker
  • Mohamadali Malakoutian
  • Samuel Graham
  • Samuel Kim
  • Srabanti Chowdhury
  • Sukwon Choi
  • Yiwen Song

Organizations

  • Air Force Office of Scientific Research
  • National Science Foundation