A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 01, 2021
Source ID
10.1109/tcpmt.2021.3118334

Entities

People

  • Joe L. Gonzalez
  • Jonathan R. Brescia
  • Muhannad S. Bakir
  • Sreejith Kochupurackal Rajan
  • Ting Zheng

Organizations

  • National Science Foundation
  • United States Air Force