Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane

Document Details

Document Type
Pub Defense Publication
Publication Date
Oct 01, 2022
Source ID
10.1109/tcpmt.2022.3207031

Entities

People

  • Amir Hanna
  • Arsalan Alam
  • Goutham Ezhilarasu
  • Guangqi Ouyang
  • Randall W. Irwin
  • Samatha Benedict
  • Subramanian S. Iyer

Organizations

  • Semiconductor Research Corporation
  • United States Army Research Laboratory
  • University of California, Los Angeles