Power Delivery Solutions and PPA Impacts in Micro-Bump and Hybrid-Bonding 3D ICs

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 01, 2022
Source ID
10.1109/tcpmt.2022.3221025

Entities

People

  • Chanmin Jo
  • Lingjun Zhu
  • Sung Kyu Lim

Organizations

  • Defense Advanced Research Projects Agency
  • Georgia Tech
  • Samsung Electronics
  • Samsung Group
  • Semiconductor Research Corporation