Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part II: Model

Document Details

Document Type
Pub Defense Publication
Publication Date
Sep 01, 2016
Source ID
10.1109/tdmr.2016.2580530

Entities

People

  • B. Talebanpour
  • I. Dutta
  • U. Sahaym

Organizations

  • Semiconductor Research Corporation
  • Strategic Environmental Research and Development Program