Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse

Document Details

Document Type
Pub Defense Publication
Publication Date
Nov 01, 2020
Source ID
10.1109/tvlsi.2020.3015494

Entities

People

  • Arvind Singh
  • Eric Qin
  • Gauthaman Murali
  • Hakki Mert Torun
  • Heechun Park
  • Hyoukjun Kwon
  • Jinwoo Kim
  • Kallol Roy
  • Madhavan Swaminathan
  • Minah Lee
  • Nael Mizanur Rahman
  • Nihar Dasari
  • Saibal Mukhopadhyay
  • Sung Kyu Lim
  • Tushar Krishna
  • Venkata Chaitanya Krishna Chekuri

Organizations

  • Defense Advanced Research Projects Agency