Investigation of the Use of an Inorganic Aqueous Solution in Copper-Made Phase-Change Heat Transfer Devices
Abstract
A novel inorganic aqueous solution (IAS) is shown to have a better heat transfer performance than water when used as the working fluid in copper-made phase-change heat transfer devices. First, the physical properties of IAS are measured and compared to those of water. Another, a chemical analysis is performed, and the chemical reactions involved between IAS and the copper surface are listed and categorized by their contributions to the heat transfer performance. In addition, a capillary rise test is performed to show how each chemical contributes to the improvement of the surface wettability. Last, using IAS in copper-made phase-change heat transfer devices is discussed, and the main focus is how IAS improves the heat transfer performance by a smaller thermal resistance and a larger critical heat flux. The conclusion is validated by thermo-siphon tests at different inclination angles.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Dec 19, 2017
- Source ID
- 10.1115/1.4038190
Entities
People
- Ivan Catton
- Jacob Supowit
- Qi Yao
Organizations
- Defense Advanced Research Projects Agency
- National Science Foundation
- University of California