Increasing Throughput in Fused Deposition Modeling by Modulating Bed Temperature
Abstract
Additive manufacturing (AM) techniques, such as fused deposition modeling (FDM), are able to fabricate physical components from three-dimensional (3D) digital models through the sequential deposition of material onto a print bed in a layer-by-layer fashion. In FDM and many other AM techniques, it is critical that the part adheres to the bed during printing. After printing, however, excessive bed adhesion can lead to part damage or prevent automated part removal. In this work, we validate a novel testing method that quickly and cheaply evaluates bed adhesion without constraints on part geometry. Using this method, we study the effect of bed temperature on the peak removal force for polylactic acid (PLA) parts printed on bare borosilicate glass and polyimide (PI)-coated beds. In addition to validating conventional wisdom that bed adhesion is maximized between 60 and 70 °C (140 and 158 °F), we observe that cooling the bed below 40 °C (104 °F), as is commonly done to facilitate part removal, has minimal additional benefit. Counterintuitively, we find that heating the bed after printing is often a more efficient process for facile part removal. In addition to introducing a general method for measuring and optimizing bed adhesion via bed temperature modulation, these results can be used to accelerate the production and testing of AM components in printer farms and autonomous research systems.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Apr 01, 2021
- Source ID
- 10.1115/1.4050177
Entities
People
- Aldair E. Gongora
- Keith A Brown
- Kelsey L. Snapp
Organizations
- Boston University
- National Science Foundation
- Office of Naval Research