Electrical characterization of atomic layer deposited Al2O3/InN interfaces

Abstract

In this article, the authors report the electrical properties of atomic layer deposited Al2O3/InN interfaces evaluated by capacitance–voltage (C-V), current–voltage (I-V), and x-ray photoemission spectroscopy techniques. I-V characteristics show low leakage currents (300 pA/μm2) in the deposited dielectrics. However, C-V curves show that ex situ surface treatments with hydrochloric acid, ammonium sulfide, and hydrobromic acid has little effect on the surface electron accumulation layer, with an estimated interface state density over 4×1013/cm2. The effect of the surface treatments on valance band offset between Al2O3 and InN was also investigated.

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 02, 2015
Source ID
10.1116/1.4936928

Entities

People

  • Amir M. Dabiran
  • Uttam Singisetti
  • Ye Jia

Organizations

  • Office of Naval Research
  • University at Buffalo

Tags

Fields of Study

  • Materials science

Readers

  • Analytical Chemistry
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene