Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics
Abstract
Thermoelectric materials hold the promise of converting waste heat into electricity. The challenge is to develop high-efficiency materials that are not too expensive. Kim et al. suggest a pathway for developing inexpensive thermoelectrics. They show a dramatic improvement of efficiency in bismuth telluride samples by quickly squeezing out excess liquid during compaction. This method introduces grain boundary dislocations in a way that avoids degrading electrical conductivity, which makes a better thermoelectric material. With the potential for scale-up and application to cheaper materials, this discovery presents an attractive path forward for thermoelectrics.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Apr 03, 2015
- Source ID
- 10.1126/science.aaa4166
Entities
People
- Dae Jin Yang
- G. Jeffrey Snyder
- Hyeon A Mun
- Hyun Sik Kim
- Jong Wook Roh
- Kyu Hyoung Lee
- Sang Il Kim
- Sung Wng Kim
- Sung Woo Hwang
- Weon Ho Shin
- Xiang Shu Li
- Young Hee Lee
Organizations
- California Institute of Technology
- Kangwon National University
- National Research Foundation of Korea
- Samsung Advanced Institute of Technology
- Sungkyunkwan University