Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 02, 2019
Source ID
10.1145/3316781.3317775

Entities

People

  • Arvind Singh
  • Eric Qin
  • Gauthaman Murali
  • Hakki Mert Torun
  • Heechun Park
  • Hyoukjun Kwon
  • Jinwoo Kim
  • Kallol Roy
  • Madhavan Swaminathan
  • Minah Lee
  • Nihar Dasari
  • Saibal Mukhopadhyay
  • Sung Kyu Lim
  • Tushar Krishna
  • Venkata Chaitanya
  • Venkata Chaitanya Krishna Chekuri

Organizations

  • Defense Advanced Research Projects Agency
  • Georgia Tech