Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs

Document Details

Document Type
Pub Defense Publication
Publication Date
Mar 30, 2020
Source ID
10.1145/3372780.3378169

Entities

People

  • Dusan Petranovic
  • Kyungwook Chang
  • Lingjun Zhu
  • Saurabh R Sinha
  • Sung Kyu Lim
  • Yun Seop Yu

Organizations

  • Defense Advanced Research Projects Agency
  • Georgia Tech
  • Hankyong National University
  • National Research Foundation of Korea