(Invited) Diverse Accessible Heterogeneous Integration (DAHI) Foundry at Northrop Grumman Aerospace Systems (NGAS)
Abstract
The requirements for future systems are increasingly demanding not only form the point of view of performance, but also from size, weight, power and cost (SWAP-C) considerations. This translates into the need for advanced integration of additional complexity and performance of electronic functions into smaller areas and volumes. In addition, to enable higher performance of the microelectronic technology in which these functions are implemented, it is not enough to use one single semiconductor technology but to combine or integrate several high performance technologies in an efficient and cost effective way. In most cases this involves the integration of semiconductor technologies based on different substrates or different technology nodes based on the same substrate. The combination of two or more dissimilar microelectronic technologies, or heterogeneous integration, leads to significant higher design flexibility and capability.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Sep 01, 2017
- Source ID
- 10.1149/ma2017-02/26/1144
Entities
People
- Aaron Oki
- Augusto Gutierrez-aitken
- Ben Poust
- Cedric Monier
- Dennis Scott
- Dino Ferizovic
- Eric Kaneshiro
- Eric Nakamura
- Ioulia Smorchkova
- Ken Sato
- Khanh Thai
- Nancy U Lin
- Reynold Kagiwada
- Wes Chan
- Xiang Zeng