(Invited) MOCVD GaN-on-GaN Towards Vertical Power Devices & MOCVD Development of β-Ga2O3
Abstract
Gallium nitride (GaN) has been considered as a promising candidate for power device applications due to the wide band gap (3.4 eV), high critical electric field (3 MV/cm) and high electron mobility (>1000 cm2/Vs). Baliga’s figure of merit (BFOM) of GaN is more than 500 times higher than silicon (Si) and more than three time higher than silicon carbide (SiC). Due to the availability of native GaN substrates, it is feasible to develop high performance GaN vertical power devices on low-defect GaN substrate. GaN-on-GaN vertical PN diode with record high VBR ~5 KV was reported [1], presenting the potential of GaN as a high-performance material for power devices. Compared with SiC, the performance of GaN vertical PN diodes is still limited by its high background doping in n-type drift layer at mid-1015 to low-1016 cm-3 range. Therefore, it is of great importance to study the sources and incorporation mechanisms of unintentionally doped background impurities in metal-organic chemical vapor deposition (MOCVD) GaN growth, to control the impurity incorporation, in order to maximize device performance for GaN based vertical power devices. This talk will discuss the dependence of MOCVD growth conditions on the impurity incorporations such as C, Si, O, H, and Fe. Quantitative SIMS and CV measurements are used for material characterization.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Nov 23, 2020
- Source ID
- 10.1149/ma2020-02261803mtgabs
Entities
People
- Hongping Zhao