A Very Robust AlGaN/GaN HEMT Technology to High Forward Gate Bias and Current
Abstract
Reports to date of GaN HEMTs subjected to forward gate bias stress include varied extents of degradation. We report an extremely robust GaN HEMT technology that survived—contrary to conventional wisdom—high forward gate bias (+6 V) and current (>1.8 A/mm) for >17.5 hours exhibiting only a slight change in gate diode characteristic, little decrease in maximum drain current, with only a 0.1 V positive threshold voltage shift, and, remarkably, a persisting breakdown voltage exceeding 200 V.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 01, 2012
- Source ID
- 10.1155/2012/493239
Entities
People
- Bradley D. Christiansen
- Eric R. Heller
- Jeffrey B. Shealy
- Ramakrishna Vetury
- Ronald A. Coutu
Organizations
- Air Force Institute of Technology
- Air Force Research Laboratory