Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects
Abstract
Copper is the primary metal used in integrated circuit manufacturing of today. Even though copper is face centered cubic it has significant mechanical anisotropy depending on the crystallographic orientations. Copper metal lines in integrated circuits are polycrystalline and typically have lognormal grain size distribution. The polycrystalline microstructure is known to impact the reliability and must be considered in modeling for better understanding of the failure mechanisms.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Mar 28, 2017
- Source ID
- 10.1186/s40759-017-0021-5
Entities
People
- Adarsh Basavalingappa
- J. R. Lloyd
- Ming Y. Shen
Organizations
- Boeing
- Defense Advanced Research Projects Agency