Deep learning multi-shot 3D localization microscopy using hybrid optical–electronic computing

Abstract

Current 3D localization microscopy approaches are fundamentally limited in their ability to image thick, densely labeled specimens. Here, we introduce a hybrid optical–electronic computing approach that jointly optimizes an optical encoder (a set of multiple, simultaneously imaged 3D point spread functions) and an electronic decoder (a neural-network-based localization algorithm) to optimize 3D localization performance under these conditions. With extensive simulations and biological experiments, we demonstrate that our deep-learning-based microscope achieves significantly higher 3D localization accuracy than existing approaches, especially in challenging scenarios with high molecular density over large depth ranges.

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 13, 2021
Source ID
10.1364/ol.441743

Entities

People

  • Gordon Wetzstein
  • Hayato Ikoma
  • Michael Broxton
  • Takamasa Kudo
  • Yifan Peng

Organizations

  • Army Research Office
  • Defense Advanced Research Projects Agency
  • National Science Foundation
  • Olympus Corporation
  • Stanford University

Tags

Fields of Study

  • Computer science

Readers

  • Image Processing and Computer Vision.
  • Medical Imaging.
  • Neural Network Machine Learning.

Technology Areas

  • AI & ML
  • AI & ML - Neural Networks
  • Microelectronics