Hydroxyl ion absorption in on-chip high-Q resonators

Abstract

Thermal silica is a common dielectric used in all-silicon photonic circuits. Additionally, bound hydroxyl ions (Si-OH) can provide a significant component of optical loss in this material on account of the wet nature of the thermal oxidation process. A convenient way to quantify this loss relative to other mechanisms is through OH absorption at 1380 nm. Here, using ultra-high-quality factor (Q-factor) thermal-silica wedge microresonators, the OH absorption loss peak is measured and distinguished from the scattering loss baseline over a wavelength range from 680 nm to 1550 nm. Record-high on-chip resonator Q-factors are observed for near-visible and visible wavelengths, and the absorption limited Q-factor is as high as 8 billion in the telecom band. Hydroxyl ion content level around 2.4 ppm (weight) is inferred from both Q measurements and by secondary ion mass spectroscopy (SIMS) depth profiling.

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 23, 2023
Source ID
10.1364/ol.492067

Entities

People

  • Hao-Jing Chen
  • Henry A. Blauvelt
  • Jin-yu Liu
  • Kellan Colburn
  • Kerry Vahala
  • Lue Wu
  • Maodong Gao

Organizations

  • California Institute of Technology
  • Defense Advanced Research Projects Agency

Tags

Fields of Study

  • Physics

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.

Technology Areas

  • AI & ML