Ultra-thin plasmonic detectors

Abstract

Plasmonic materials, and their ability to enable strong concentration of optical fields, have offered a tantalizing foundation for the demonstration of sub-diffraction-limit photonic devices. However, practical and scalable plasmonic optoelectronics for real world applications remain elusive. In this work, we present an infrared photodetector leveraging a device architecture consisting of a “designer” epitaxial plasmonic metal integrated with a quantum-engineered detector structure, all in a mature III-V semiconductor material system. Incident light is coupled into surface plasmon-polariton modes at the detector/designer metal interface, and the strong confinement of these modes allows for a sub-diffractive ( ∼ λ 0 / 33 ) detector absorber layer thickness, effectively decoupling the detector’s absorption efficiency and dark current. We demonstrate high-performance detectors operating at non-cryogenic temperatures ( T = 195 K ), without sacrificing external quantum efficiency, and superior to well-established and commercially available detectors. This work provides a practical and scalable plasmonic optoelectronic device architecture with real world mid-infrared applications.

Document Details

Document Type
Pub Defense Publication
Publication Date
Dec 08, 2021
Source ID
10.1364/optica.438039

Entities

People

  • Aaron J. Muhowski
  • Abhilasha Kamboj
  • Daniel Wasserman
  • Leland Nordin
  • Priyanka Petluru

Organizations

  • Defense Advanced Research Projects Agency
  • Division of Electrical, Communications & Cyber Systems
  • Division of Materials Research
  • Lockheed Martin
  • National Science Foundation
  • University of Texas at Austin

Tags

Fields of Study

  • Materials science
  • Physics

Readers

  • Distributed Systems and Data Platform Development
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.

Technology Areas

  • Microelectronics
  • Quantum Computing