Crack-Free High-Composition (>35%) Thick-Barrier (>30 nm) AlGaN/AlN/GaN High-Electron-Mobility Transistor on Sapphire with Low Sheet Resistance (<250 Ω/□)
Abstract
In this article, a high-composition (>35%) thick-barrier (>30 nm) AlGaN/AlN/GaN high-electron-mobility transistor (HEMT) structure grown on a sapphire substrate with ultra-low sheet resistivity (<250 Ω/□) is reported. The optimization of growth conditions, such as reduced deposition rate, and the thickness optimization of different epitaxial layers allowed us to deposit a crack-free high-composition and thick AlGaN barrier layer HEMT structure. A significantly high two-dimensional electron gas (2DEG) density of 1.46 × 1013 cm−2 with a room-temperature mobility of 1710 cm2/V·s was obtained via Hall measurement using the Van der Pauw method. These state-of-the-art results show great potential for high-power Ga-polar HEMT design on sapphire substrates.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Sep 30, 2023
- Source ID
- 10.3390/cryst13101456
Entities
People
- Cheng Liu
- Chirag Gupta
- Guangying Wang
- Jiahao Chen
- Md Tahmidul Alam
- Ruixin Bai
- Shubhra S Pasayat
- Surjava Sanyal
- Swarnav Mukhopadhyay
Organizations
- Office of Naval Research
- University of Wisconsin–Madison