Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating
Abstract
We devised a scalable, modular strategy for microfabricated 3-D neural probe synthesis. We constructed a 3-D probe out of individual 2-D components (arrays of shanks bearing close-packed electrodes) using mechanical self-locking and self-aligning techniques, followed by electroless nickel plating to establish electrical contact between the individual parts. We detail the fabrication and assembly process and demonstrate different 3-D probe designs bearing thousands of electrode sites. We find typical self-alignment accuracy between shanks of <0.2° and demonstrate orthogonal electrical connections of 40 µm pitch, with thousands of connections formed electrochemically in parallel. The fabrication methods introduced allow the design of scalable, modular electrodes for high-density 3-D neural recording. The combination of scalable 3-D design and close-packed recording sites may support a variety of large-scale neural recording strategies for the mammalian brain.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Aug 30, 2018
- Source ID
- 10.3390/mi9090436
Entities
People
- Anthony Zorzos
- Caroline Moore-kochlacs
- Clifton Fonstad
- Edward Boyden
- Jacob Bernstein
- Jorg Scholvin
- Justin Kinney
- Nancy Kopell
Organizations
- Defense Advanced Research Projects Agency
- Foundation for the National Institutes of Health
- National Science Foundation
- New York Stem Cell Foundation