Harsh Environment Robust Micromechanical Technology (HERMIT)
Abstract
The Harsh Environment Robust Micromechanical Technology (HERMIT) program developed micromechanical devices that operate under harsh conditions (e.g., under large temperature excursions, large power throughputs, high g-forces, corrosive substances) while maintaining unprecedented performance, stability, and lifetime. Micromechanical RF switches were of particular interest, where sizable power throughputs and impacting operation constitute harsh operational environments. Other applications such as vibrating resonator reference tanks, gyroscopes, and accelerometers were also addressed. Among the HERMIT implementation approaches pursued were: 1) wafer-level encapsulation or packaging strategies based on MicroElectroMechanical systems (MEMS) technology that isolates a micromechanical device from its surroundings while maintaining a desired environment via passive or active control; and 2) material and design engineering strategies that render a micromechanical device impervious to its environment with or without a package (if possible). The technology transitioned through Industry.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2012
- Source ID
- 2b140fed0de25296eb1f0b7ff37278dd