Artemis

Abstract

Artemis develops and demonstrates a sensor package optimized for high-altitude operations. The multi-mode sensors are packaged to minimize size and power requirements and to protect electronics from environmental interference. Design of the sensor package initiated in FY 2022, with a demonstration of the sensor package during stratospheric flight planned for FY 2024, before transition to the U.S. Army for qualification testing. In FY 2023, Artemis transitions to Program Element 0603838D8Z Defense Innovation Acceleration for further development.

Document Details

Document Type
Accomplishment
Publication Date
Oct 01, 2024
Source ID
2cb241acf599cefdda652bbce1f7d792

Tags

Readers

  • Aerospace Test and Evaluation
  • Military Science and Technology Research and Modernization.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems
  • Space
  • Space - Satellites

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